- 专利标题: METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
-
申请号: US15992822申请日: 2018-05-30
-
公开(公告)号: US20180351033A1公开(公告)日: 2018-12-06
- 发明人: Pun Jae CHOI , Yu Seung KIM , Jin Bock LEE
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 优先权: KR10-2008-0103671 20081022; KR10-2009-0100912 20091022
- 主分类号: H01L33/00
- IPC分类号: H01L33/00 ; H01L33/40 ; H01L33/08 ; H01L33/38 ; H01L33/42 ; H01L33/22 ; H01L33/20
摘要:
There is provided a semiconductor light emitting device including a conductive substrate, a first electrode layer, an insulating layer, a second electrode layer, a second semiconductor layer, an active layer, and a first semiconductor layer that are sequentially stacked. The contact area between the first electrode layer and the first semiconductor layer is 3% to 13% of the total area of the semiconductor light emitting device, and thus high luminous efficiency is achieved.
公开/授权文献
- US10333023B2 Method of manufacturing semiconductor light emitting device 公开/授权日:2019-06-25
信息查询
IPC分类: