发明申请
- 专利标题： SOLDER PASTE FOR REDUCTION GAS, AND METHOD FOR PRODUCING SOLDERED PRODUCT
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申请号： US15764165申请日： 2016-09-29
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公开(公告)号： US20190009375A1公开(公告)日： 2019-01-10
- 发明人: Yukiko HAYASHI , Arisa SHIRAISHI , Naoto OZAWA , Takayuki SUZUKI , Takeshi SHIRAI , Noriyoshi UCHIDA , Mitsuyasu FURUSAWA
- 申请人： ORIGIN ELECTRIC COMPANY, LIMITED , KOKI COMPANY LIMITED
- 优先权： JP2015-195177 20150930
- 国际申请： PCT/JP2016/078961 WO 20160929
- 主分类号： B23K35/38
- IPC分类号： B23K35/38 ; B23K35/36 ; B23K35/26 ; B23K3/04 ; B23K1/19 ; B23K37/00
摘要：
The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.
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