Invention Application
- Patent Title: High Electron Mobility Transistors
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Application No.: US16132793Application Date: 2018-09-17
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Publication No.: US20190013399A1Publication Date: 2019-01-10
- Inventor: Po-Chun Liu , Chung-Yi Yu , Chi-Ming Chen , Chen-Hao Chiang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/66 ; H01L29/20 ; H01L29/205 ; H01L29/43 ; H01L29/201

Abstract:
The present disclosure, in some embodiments, relates to a transistor device. The transistor device includes a layer of GaN over a substrate. A mobility-enhancing layer of AlzGa(1-z)N is over the layer of GaN and has a first molar fraction z in a first range of between approximately 0.25 and approximately 0.4. A resistance-reducing layer of AlxGa(1-x)N is over the mobility-enhancing layer and has a second molar fraction x in a second range of between approximately 0.1 and approximately 0.15. A source has a source contact and an underlying source region. A drain has a drain contact and an underlying drain region. The source and drain regions extend through the resistance-reducing layer of AlxGa(1-x)N and into the mobility-enhancing layer of AlzGa(1-z)N. The source and drain regions have bottoms over a bottom of the mobility-enhancing layer of AlzGa(1-z)N. A gate structure is laterally between the source and drain contacts.
Public/Granted literature
- US10991819B2 High electron mobility transistors Public/Granted day:2021-04-27
Information query
IPC分类: