Invention Application
- Patent Title: MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURE
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Application No.: US16137914Application Date: 2018-09-21
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Publication No.: US20190016591A1Publication Date: 2019-01-17
- Inventor: Te-Huang Chiu , Weng-Yi Chen , Kuan-Yu Wang
- Applicant: UNITED MICROELECTRONICS CORP.
- Priority: TW106102636 20170124
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B7/00
Abstract:
A manufacturing method for a semiconductor structure is disclosed. The semiconductor structure includes a MEMS region. The MEMS region includes a sensing membrane and a metal ring. The metal ring defines a cavity under the sensing membrane.
Public/Granted literature
- US10427935B2 Manufacturing method for semiconductor structure Public/Granted day:2019-10-01
Information query
