Invention Application
- Patent Title: CIRCUIT BOARDS AND ELECTRONIC PACKAGES WITH EMBEDDED TAMPER-RESPONDENT SENSOR
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Application No.: US16136589Application Date: 2018-09-20
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Publication No.: US20190017844A1Publication Date: 2019-01-17
- Inventor: William L. BRODSKY , Silvio DRAGONE , Roger S. KRABBENHOFT , David C. LONG , Stefano S. OGGIONI , Michael T. PEETS , William SANTIAGO-FERNANDEZ
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Main IPC: G01D5/16
- IPC: G01D5/16 ; H05K1/02 ; H05K3/32 ; H05K3/30 ; H05K1/18

Abstract:
Methods of fabricating electronic circuits and electronic packages are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.
Public/Granted literature
- US10378924B2 Circuit boards and electronic packages with embedded tamper-respondent sensor Public/Granted day:2019-08-13
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