-
1.发明申请公开(公告)号：US20190037686A1
公开(公告)日：2019-01-31
申请号：US15658717
申请日：2017-07-25
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. BUSBY , John R. DANGLER , Michael J. FISHER , David C. LONG
CPC classification number: H05K1/0275 , G01N27/045 , G06F21/86 , G06F21/87 , H05K1/0298 , H05K1/09 , H05K1/115 , H05K1/181 , H05K5/0208 , H05K2201/10151 , H05K2201/10204 , H05K2201/10371 , H05K2201/10522
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.
-
公开(公告)号：US20180098424A1
公开(公告)日：2018-04-05
申请号：US15831534
申请日：2017-12-05
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： James A. BUSBY , Silvio DRAGONE , Michael J. FISHER , Michael A. GAYNES , David C. LONG , Kenneth P. RODBELL , William SANTIAGO-FERNANDEZ , Thomas WEISS
CPC classification number: H05K1/0275 , G06F21/87 , H05K1/181 , H05K1/185 , H05K5/0208 , H05K2201/10151 , H05K2201/10371
Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed surface layer, and the tamper-respondent detector monitors, at least in part, the stressed glass to facilitate defining the secure volume. The stressed glass fragments with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detects the fragmenting of the stressed glass. In certain embodiments, the stressed glass may be a machined glass enclosure that has undergone ion-exchange processing, and the compressively-stressed surface layer of the stressed glass may be compressively-stressed to ensure that the stressed glass fragments into glass particles of fragmentation size less than 1000 μm with the intrusion event.
-
公开(公告)号：US20180070444A1
公开(公告)日：2018-03-08
申请号：US15800497
申请日：2017-11-01
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. BRODSKY , James A. BUSBY , Phillip Duane ISAACS , David C. LONG
CPC classification number: H05K1/0275 , H05K1/0298 , H05K1/034 , H05K1/09 , H05K1/183 , H05K3/12 , H05K3/30 , H05K3/301 , H05K3/46 , H05K5/0208 , H05K7/023 , H05K2201/015 , H05K2201/05 , H05K2201/055 , H05K2201/056
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≦200 μm, as well as a line-to-line spacing width Ws≦200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
-
公开(公告)号：US20170181274A1
公开(公告)日：2017-06-22
申请号：US15423833
申请日：2017-02-03
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. BRODSKY , James A. BUSBY , Edward N. COHEN , Silvio DRAGONE , Michael J. FISHER , David C. LONG , Michael T. PEETS , William SANTIAGO-FERNANDEZ , Thomas WEISS
CPC classification number: H05K1/0275 , G08B13/128 , H05K1/0216 , H05K1/112 , H05K1/181 , H05K3/22 , H05K5/0208 , H05K2201/10151 , H05K2201/10265 , H05K2201/10371
Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.
-
公开(公告)号：US20170091492A1
公开(公告)日：2017-03-30
申请号：US14865572
申请日：2015-09-25
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. BRODSKY , John R. DANGLER , Phillip Duane ISAACS , David C. LONG , Michael T. PEETS
CPC classification number: G06F21/87 , G06F21/75 , H01R12/59 , H05K1/0275 , H05K5/0208 , H05K5/03 , H05K2201/055 , H05K2201/056
Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
-
Patent Agency Ranking
公开(公告)号：US20190261506A1
公开(公告)日：2019-08-22
申请号：US16285437
申请日：2019-02-26
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Kathleen Ann FADDEN , James A. BUSBY , David C. LONG , John R. DANGLER , Alexandra ECHEGARAY , Michael J. FISHER , William SANTIAGO-FERNANDEZ
Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure-to-circuit board protection. The tamper-respondent assemblies include a circuit board, and an enclosure mounted to the circuit board along an enclosure-to-board interface. The enclosure facilitates enclosing at least one electronic component coupled to the circuit board within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and includes one or more tamper-detect circuits including at least one conductive trace disposed, at least in part, within the enclosure-to-board interface. The conductive trace(s) includes stress rise regions to facilitate tamper-detection at the enclosure-to-board interface. An adhesive is provided to secure the enclosure to the circuit board. The adhesive contacts, at least in part, the conductive trace(s) of the tamper-detect circuit(s) at the enclosure-to-board interface, including at the stress rise regions of the conductive trace(s).
-
公开(公告)号：US20170135237A1
公开(公告)日：2017-05-11
申请号：US15409851
申请日：2017-01-19
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. BRODSKY , John R. DANGLER , Zachary T. DREISS , David C. LONG , Michael T. PEETS , William SANTIAGO-FERNANDEZ , Thomas WEISS
CPC classification number: H05K5/0247 , G06F1/00 , H05K5/0208 , H05K13/00
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure and a tamper-respondent electronic circuit structure. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner main surface, and an inner sidewall surface which has at least one inner-sidewall corner. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner sidewall surface of the electronic enclosure. The tamper-respondent sensor includes a flexible layer(s) with tamper-detect circuit lines and multiple slots provided therein. The multiple slots facilitate disposing the tamper-respondent sensor to cover the at least one inner-sidewall corner of the inner sidewall surface by allowing for one or more regions of overlap of the flexible layer(s) of the tamper-respondent sensor at the at least one inner-sidewall corner of the electronic enclosure.
-
公开(公告)号：US20170094820A1
公开(公告)日：2017-03-30
申请号：US14941860
申请日：2015-11-16
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. BRODSKY , James A. BUSBY , Zachary T. DREISS , Michael J. FISHER , David C. LONG , William SANTIAGO-FERNANDEZ , Thomas WEISS
CPC classification number: H05K1/0213 , G06F21/87 , H05K1/0275 , H05K1/183 , H05K5/0208 , H05K2201/10151
Abstract: Methods of fabricating tamper-respondent assemblies with bond protection are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).
-
公开(公告)号：US20170094819A1
公开(公告)日：2017-03-30
申请号：US14865651
申请日：2015-09-25
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. BRODSKY , John R. DANGLER , Zachary T. DREISS , David C. LONG , Michael T. PEETS , William SANTIAGO-FERNANDEZ , Thomas WEISS
IPC: H05K5/02
CPC classification number: H05K5/0247 , G06F1/00 , H05K5/0208 , H05K13/00
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure and a tamper-respondent electronic circuit structure. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner main surface, and an inner sidewall surface which has at least one inner-sidewall corner. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner sidewall surface of the electronic enclosure. The tamper-respondent sensor includes multiple slots provided therein. The multiple slots facilitate disposing the tamper-respondent sensor to cover the at least one inner-sidewall corner of the inner sidewall surface by allowing for one or more regions of overlap of the tamper-respondent sensor at the at least one inner-sidewall corner of the electronic enclosure.
-
公开(公告)号：US20170094806A1
公开(公告)日：2017-03-30
申请号：US14941887
申请日：2015-11-16
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. BRODSKY , James A. BUSBY , Phillip Duane ISAACS , David C. LONG
CPC classification number: H05K1/0275 , H05K1/0298 , H05K1/034 , H05K1/09 , H05K1/183 , H05K3/12 , H05K3/30 , H05K3/301 , H05K3/46 , H05K5/0208 , H05K7/023 , H05K2201/015 , H05K2201/05 , H05K2201/055 , H05K2201/056
Abstract: Methods of fabricating tamper-respondent assemblies are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≦200 μm, as well as a line-to-line spacing width Ws≦200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
-
-
-
-
-
-
-
-
-
Search Results
38
records
(took 0.036 seconds)
