Disclosed are an apparatus and a method for drying a substrate. The apparatus for drying a substrate, the apparatus includes a chamber having a treatment space in the interior thereof, a substrate support unit configured to the substrate in the treatment space, a conversion unit configured to convert a state of the substrate supported by the substrate support unit between a horizontal state and an inclined state, a fluid supply unit configured to supply a drying fluid into the treatment space, and a controller configured to control the conversion unit and the fluid supply unit. Because a part of the liquid that stays on the substrate may be made to flow down by converting the state of the substrate into an inclined state and the remaining liquid that stays on the substrate is removed by using the drying fluid later, a time for drying the substrate may be shortened.