Invention Application
- Patent Title: SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS
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Application No.: US16074669Application Date: 2016-11-02
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Publication No.: US20190057997A1Publication Date: 2019-02-21
- Inventor: Hideaki TOGASHI , Kosuke NAKANISHI
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2016-022717 20160209
- International Application: PCT/JP2016/082572 WO 20161102
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L29/08 ; H01L29/423

Abstract:
A semiconductor device of the present disclosure includes: a semiconductor element disposed on a first surface side of a semiconductor substrate; a through-electrode that is provided through the semiconductor substrate in a thickness direction of the semiconductor substrate and introduces charge obtained in the semiconductor element to a second surface side of the semiconductor substrate; and an amplifier transistor that outputs an electrical signal based on the charge introduced by the through-electrode, the amplifier transistor using the through-electrode as a gate electrode and including a source region and a drain region around the through-electrode.
Public/Granted literature
Information query
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