Invention Application
- Patent Title: TRENCH-GATE INSULATED-GATE BIPOLAR TRANSISTORS (IGBTs) AND METHODS OF MANUFACTURE
-
Application No.: US15884773Application Date: 2018-01-31
-
Publication No.: US20190058055A1Publication Date: 2019-02-21
- Inventor: Meng-Chia LEE , Ralph N. WALL , Mingjiao LIU , Shamsul Arefin KHAN , Gordon M. GRIVNA
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/66 ; H01L29/423 ; H01L29/06

Abstract:
In a general aspect, an insulated gate bipolar transistor (IGBT) device can include an active region, an inactive region and a trench extending along a longitudinal axis in the active region. The IGBT can also include a first mesa defining a first sidewall of the trench and in parallel with the trench and a second mesa defining a second sidewall of the trench and in parallel with the trench. At least a portion of the first mesa can include an active segment of the IGBT device, and at least a portion of the second mesa can include an inactive segment of the IGBT device.
Public/Granted literature
- US10727326B2 Trench-gate insulated-gate bipolar transistors (IGBTs) Public/Granted day:2020-07-28
Information query
IPC分类: