A through electrode substrate includes: a substrate; a first electrode part provided on a first surface side of the substrate; and a second electrode part provided on a second surface side of the substrate. The plurality of holes includes a plurality of first holes and a plurality of second holes. The hole electrode part of each first hole is electrically connected to the first electrode part on the first surface side of the substrate, and the hole electrode part thereof is electrically connected to the second electrode part on the second surface side of the substrate. The electrode part of each second hole is electrically insulated from the first electrode part on the first surface side of the substrate, or the hole electrode part thereof is electrically insulated from the second electrode part on the second surface side of the substrate.