Invention Application
- Patent Title: INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT
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Application No.: US16206463Application Date: 2018-11-30
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Publication No.: US20190092963A1Publication Date: 2019-03-28
- Inventor: Mitsuru Tanikawa , Takashi Watanabe , Yusuke Fujita , Yoshito Fujita , Tasuku Yamada
- Applicant: SEKISUI CHEMICAL CO., LTD.
- Priority: JP2015-010566 20150122; JP2015-010567 20150122; JP2015-144909 20150722; JP2015-144910 20150722
- Main IPC: C09D133/14
- IPC: C09D133/14 ; C09J4/06 ; C09J133/14 ; C09J171/12 ; H01L23/00 ; C08G59/68 ; C08G59/42 ; C09D11/101 ; C09D11/30 ; C09D133/10 ; C09J133/10 ; C09J5/06 ; C08L33/08 ; C08G59/50 ; H01L21/52 ; C09J201/02 ; C09J163/00 ; C09D11/107 ; C09D11/52 ; C09J5/04 ; C09J9/02 ; C08L33/04

Abstract:
Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.
Public/Granted literature
- US10961411B2 Inkjet adhesive, manufacturing method for semiconductor device, and electronic component Public/Granted day:2021-03-30
Information query
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