- 专利标题： Component Carrier Having a Three Dimensionally Printed Wiring Structure
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申请号： US16153199申请日： 2018-10-05
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公开(公告)号： US20190110367A1公开(公告)日： 2019-04-11
- 发明人: Marco Gavagnin , Markus Leitgeb , Jonathan Silvano de Sousa , Ferdinand Lutschounig
- 申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- 优先权： EP17195331.8 20171006
- 主分类号： H05K3/46
- IPC分类号： H05K3/46 ; H05K1/11 ; H05K3/10 ; H05K3/36
摘要：
A component carrier and a method for manufacturing a component carrier is described wherein the component carrier includes a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures where the wiring structure is at least partially formed as a three-dimensionally printed structure.
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