- 专利标题: SYSTEM LEVEL INTEGRATED CIRCUIT CHIP
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申请号: US15857672申请日: 2017-12-29
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公开(公告)号: US20190114268A1公开(公告)日: 2019-04-18
- 发明人: Jinghui Zhu , San-Ta Kow , Tun Jun Gao , Diwakar Chopperla , Chienkuang Chen , Ning Song
- 申请人: Gowin Semiconductor Corporation
- 申请人地址: CN Foshan
- 专利权人: Gowin Semiconductor Corporation
- 当前专利权人: Gowin Semiconductor Corporation
- 当前专利权人地址: CN Foshan
- 优先权: CN201710969935.4 20171018
- 主分类号: G06F13/10
- IPC分类号: G06F13/10 ; H03K19/177 ; G06F13/42 ; G06F12/06
摘要:
The present application discloses a system level integrated circuit chip, comprising a fixed logic module and a Programmable Logic Module; the fixed logic module comprising a CPU module, a non-volatile memory module, a high speed data transmission module, an analogue-to-digital and/or digital-to-analogue conversion module; the Programmable Logic Module comprising a user-defined field programmable gate array and a programmable control module; the CPU module is interconnected with the user-defined field programmable gate array and the programmable control module; the non-volatile memory is interconnected with the user-defined field programmable gate array and the programmable control module; the analogue-to-digital and/or digital-to-analogue conversion module are connected with the user-defined field programmable gate array; and the high speed data transmission module is interconnected with the user-defined field programmable gate array. The present application solves the problem of the combination of a variety of different devices and the integration of processing capabilities with different applications.
公开/授权文献
- US11157421B2 System level integrated circuit chip 公开/授权日:2021-10-26