Invention Application
- Patent Title: SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF
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Application No.: US16219979Application Date: 2018-12-14
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Publication No.: US20190115271A1Publication Date: 2019-04-18
- Inventor: Yung-Ping Chiang , Chao-Wen Shih , Shou-Zen Chang , Albert Wan , Yu-Sheng Hsieh
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01Q21/06 ; H01Q9/04 ; H01Q1/22 ; H01L21/768 ; H01L23/00 ; H01L23/66 ; H01L23/528 ; H01L23/48
Abstract:
Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.
Information query
IPC分类:
