- 专利标题: SEMICONDUCTOR DEVICE HAVING FIRST AND SECOND ELECTRODE LAYERS ELECTRICALLY DISCONNECTED FROM EACH OTHER BY A SLIT
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申请号: US16210131申请日: 2018-12-05
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公开(公告)号: US20190115481A1公开(公告)日: 2019-04-18
- 发明人: Hiroki YAMAMOTO
- 申请人: ROHM CO., LTD.
- 申请人地址: JP Kyoto
- 专利权人: ROHM CO., LTD.
- 当前专利权人: ROHM CO., LTD.
- 当前专利权人地址: JP Kyoto
- 优先权: JP2011-227964 20111017; JP2011-270253 20111209; JP2012-060557 20120316; JP2012-060558 20120316; JP2012-060559 20120316; JP2012-086784 20120405; JP2012-148862 20120702; JP2012-149732 20120703; JP2012-149733 20120703; JP2012-149734 20120703; JP2012-217882 20120928
- 主分类号: H01L29/872
- IPC分类号: H01L29/872 ; H01L29/66 ; H01L29/861 ; H01L27/06 ; H01L49/02 ; H01L29/417 ; H01L23/00 ; H01L27/102 ; H01L23/544 ; H01L29/06 ; H01L29/866 ; H01L23/522 ; H01L23/495 ; H01L27/07
摘要:
A chip part includes a substrate, an element formed on the substrate, and an electrode formed on the substrate. A recess and/or projection expressing information related to the element is formed at a peripheral edge portion of the substrate.