发明申请
- 专利标题: SIC EPITAXIAL WAFER
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申请号: US16152971申请日: 2018-10-05
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公开(公告)号: US20190148496A1公开(公告)日: 2019-05-16
- 发明人: Naoto ISHIBASHI , Keisuke FUKADA
- 申请人: SHOWA DENKO K.K.
- 申请人地址: JP Tokyo
- 专利权人: SHOWA DENKO K.K.
- 当前专利权人: SHOWA DENKO K.K.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2017-219397 20171114
- 主分类号: H01L29/16
- IPC分类号: H01L29/16 ; H01L29/06 ; H01L21/02 ; H01L29/04
摘要:
An SiC epitaxial wafer according to the present invention includes: an SiC single crystal substrate; and a carrier concentration variation layer disposed on one face side of the SiC single crystal substrate, wherein the carrier concentration variation layer includes: high concentration layers in which carrier concentrations thereof are higher than carrier concentrations of adjacent layers; and low concentration layers in which carrier concentrations are lower than in adjacent layers, and the high concentration layers and the low concentration layers are laminated alternately.
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