HIGH PURITY METALLIC TOP COAT FOR SEMICONDUCTOR MANUFACTURING COMPONENTS
摘要:
An article comprises a component for a manufacturing chamber, a coating on the component, and an anodization layer formed on the coating. The anodization layer has a thickness of about 2-10 mil, comprises a low porosity layer portion having a density of greater than 99% and a porous columnar layer portion having a higher porosity than the low porosity layer portion. The porous columnar layer portion comprises a plurality of columnar nanopores having a diameter of about 10-50 nm.
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