Invention Application
- Patent Title: COMPOSITIONS AND METHODS OF MAKING THIN WALL HOUSINGS FOR ELECTRONIC DEVICES
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Application No.: US16294458Application Date: 2019-03-06
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Publication No.: US20190203033A1Publication Date: 2019-07-04
- Inventor: Thomas L. Evans , Jon Michael Malinoski
- Applicant: SABIC GLOBAL TECHNOLOGIES B.V.
- Main IPC: C08L53/00
- IPC: C08L53/00 ; C08L63/00 ; C08L69/00 ; C08K5/526 ; C08L33/06
Abstract:
Provided herein are high flow and ductile thermoplastic resin compositions for the formation of thin wall devices and devices with desirable impact strengths. These compositions are useful in the manufacture of various shaped, formed and/or molded devices.
Information query
