Invention Application
- Patent Title: TRANSFER CHAMBERS WITH AN INCREASED NUMBER OF SIDES, SEMICONDUCTOR DEVICE MANUFACTURING PROCESSING TOOLS, AND PROCESSING METHODS
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Application No.: US16359561Application Date: 2019-03-20
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Publication No.: US20190214284A1Publication Date: 2019-07-11
- Inventor: Michael Robert Rice , Michael Meyers , John J. Mazzocco , Dean C. Hruzek , Michael Kuchar , Sushant S. Koshti , Penchala N. Kankanala , Eric A. Englhardt
- Applicant: Applied Materials, Inc.
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677
Abstract:
A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.
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