公开(公告)号：US11087998B2

公开(公告)日：2021-08-10

申请号：US16359561

申请日：2019-03-20

Applicant: Applied Materials, Inc.

Inventor： Michael Robert Rice ,  Michael Meyers ,  John J. Mazzocco ,  Dean C. Hruzek ,  Michael Kuchar ,  Sushant S. Koshti ,  Penchala N. Kankanala ,  Eric A. Englhardt

IPC: H01L21/67 ,  H01L21/677

Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US20210143034A1

公开(公告)日：2021-05-13

申请号：US17248395

申请日：2021-01-22

Applicant: Applied Materials, Inc.

Inventor： Michael Robert Rice ,  Michael Meyers ,  John J. Mazzocco ,  Dean C. Hruzek ,  Michael Kuchar ,  Sushant S. Koshti ,  Penchala N. Kankanala ,  Eric A. Englhardt

IPC: H01L21/67 ,  H01L21/677

Abstract: A substrate processing system includes a factory interface, a transfer chamber, and a robot. The transfer chamber includes four first facets adapted for attachment to one or more first processing chambers and three second facets, wherein each of the three second facets has a width that is narrower than that of each of the four first facets. The system includes a second processing chamber having a first interface attached to a first of the three second facets and a load lock attached to a second of the three second facets and to the factory interface. The system also includes a robot attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the one or more first processing chambers, the second processing chamber, and the load lock.

公开(公告)号：US20190214284A1

公开(公告)日：2019-07-11

申请号：US16359561

申请日：2019-03-20

Applicant: Applied Materials, Inc.

Inventor： Michael Robert Rice ,  Michael Meyers ,  John J. Mazzocco ,  Dean C. Hruzek ,  Michael Kuchar ,  Sushant S. Koshti ,  Penchala N. Kankanala ,  Eric A. Englhardt

IPC: H01L21/67 ,  H01L21/677

Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US10971381B2

公开(公告)日：2021-04-06

申请号：US15029502

申请日：2014-11-03

Applicant: Applied Materials, Inc.

Inventor： Michael Robert Rice ,  Michael Meyers ,  John J. Mazzocco ,  Dean C. Hruzek ,  Michael Kuchar ,  Sushant S. Koshti ,  Penchala N. Kankanala ,  Eric A. Englhardt

IPC: H01L21/67 ,  H01L21/677

Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.