公开(公告)号：US20190214284A1

公开(公告)日：2019-07-11

申请号：US16359561

申请日：2019-03-20

Applicant: Applied Materials, Inc.

Inventor： Michael Robert Rice ,  Michael Meyers ,  John J. Mazzocco ,  Dean C. Hruzek ,  Michael Kuchar ,  Sushant S. Koshti ,  Penchala N. Kankanala ,  Eric A. Englhardt

IPC: H01L21/67 ,  H01L21/677

Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US20210143034A1

公开(公告)日：2021-05-13

申请号：US17248395

申请日：2021-01-22

Applicant: Applied Materials, Inc.

Inventor： Michael Robert Rice ,  Michael Meyers ,  John J. Mazzocco ,  Dean C. Hruzek ,  Michael Kuchar ,  Sushant S. Koshti ,  Penchala N. Kankanala ,  Eric A. Englhardt

IPC: H01L21/67 ,  H01L21/677

Abstract: A substrate processing system includes a factory interface, a transfer chamber, and a robot. The transfer chamber includes four first facets adapted for attachment to one or more first processing chambers and three second facets, wherein each of the three second facets has a width that is narrower than that of each of the four first facets. The system includes a second processing chamber having a first interface attached to a first of the three second facets and a load lock attached to a second of the three second facets and to the factory interface. The system also includes a robot attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the one or more first processing chambers, the second processing chamber, and the load lock.

公开(公告)号：US10971381B2

公开(公告)日：2021-04-06

申请号：US15029502

申请日：2014-11-03

Applicant: Applied Materials, Inc.

Inventor： Michael Robert Rice ,  Michael Meyers ,  John J. Mazzocco ,  Dean C. Hruzek ,  Michael Kuchar ,  Sushant S. Koshti ,  Penchala N. Kankanala ,  Eric A. Englhardt

IPC: H01L21/67 ,  H01L21/677

Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US11087998B2

公开(公告)日：2021-08-10

申请号：US16359561

申请日：2019-03-20

Applicant: Applied Materials, Inc.

Inventor： Michael Robert Rice ,  Michael Meyers ,  John J. Mazzocco ,  Dean C. Hruzek ,  Michael Kuchar ,  Sushant S. Koshti ,  Penchala N. Kankanala ,  Eric A. Englhardt

IPC: H01L21/67 ,  H01L21/677

Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US20180350637A1

公开(公告)日：2018-12-06

申请号：US16102670

申请日：2018-08-13

Applicant: Applied Materials, Inc.

Inventor： John J. Mazzocco ,  Edward Ng ,  Douglas MacLeod ,  David Phillips ,  Ayan Majumdar ,  Jeffrey C. Hudgens

IPC: H01L21/673 ,  H01L21/67 ,  G01V8/12

CPC classification number: H01L21/6732 ,  G01V8/12 ,  H01L21/67259

Abstract: Methods, apparatus, and assemblies are provided for a substrate carrier adapter insert including an adapter frame including a support rail adapted to support one or more substrates in a substrate carrier, a frame extension coupled to, or integral with, the adapter frame, and a mapping feature formed on the frame extension and disposed to be detected by a sensor for determining whether an adapter insert is present or absent in a substrate carrier. Numerous additional features are disclosed.

公开(公告)号：US10115616B2

公开(公告)日：2018-10-30

申请号：US14332976

申请日：2014-07-16

Applicant: Applied Materials, Inc.

Inventor： John J. Mazzocco ,  Edward Ng ,  Douglas MacLeod ,  David Phillips ,  Ayan Majumdar ,  Jeffrey C. Hudgens

IPC: H01L21/67 ,  H01L21/673 ,  G01V8/12

Abstract: Methods, apparatus, and assemblies are provided for an adapter insert including an adapter frame including a support rail adapted to support one or more substrates in a substrate carrier, a frame extension coupled to, or integral with, the adapter frame, and a mapping feature formed on the frame extension and disposed to be detected by a sensor for determining whether an adapter insert is present or absent in a substrate carrier. Numerous additional features are disclosed.

公开(公告)号：US11211230B2

公开(公告)日：2021-12-28

申请号：US16838987

申请日：2020-04-02

Applicant: Applied Materials, Inc.

Inventor： Keith A. Miller ,  Wei W. Wang ,  Alexander Erenstein ,  John J. Mazzocco

IPC: H01J37/32 ,  C23C14/34 ,  C23C14/50 ,  B25J18/00

Abstract: A gas flow system is provided, including a gas flow source, one or more gas inlets, one or more gas outlets, a gas flow region, a low pressure region, wherein the low pressure region is fluidly coupled to the one or more gas outlets, a high pressure region, and a gap. The one or more gas inlets are fluidly coupleable to the gas flow source. The gas flow region is fluidly coupled to the one or more gas inlets and the one or more gas outlets. The gap fluidly couples the gas flow region to the high pressure region. The high pressure region near the targets allows for process gas interactions with the target to sputter onto the substrate below. The low pressure region near the substrate prevents unwanted chemical interactions between the process gas and the substrate.

公开(公告)号：US11018036B2

公开(公告)日：2021-05-25

申请号：US16102670

申请日：2018-08-13

Applicant: Applied Materials, Inc.

Inventor： John J. Mazzocco ,  Edward Ng ,  Douglas MacLeod ,  David Phillips ,  Ayan Majumdar ,  Jeffrey C. Hudgens

IPC: H01L21/00 ,  H01L21/673 ,  G01V8/12 ,  H01L21/67

Abstract: Methods, apparatus, and assemblies are provided for a substrate carrier adapter insert including an adapter frame including a support rail adapted to support one or more substrates in a substrate carrier, a frame extension coupled to, or integral with, the adapter frame, and a mapping feature formed on the frame extension and disposed to be detected by a sensor for determining whether an adapter insert is present or absent in a substrate carrier. Numerous additional features are disclosed.

公开(公告)号：US10196845B2

公开(公告)日：2019-02-05

申请号：US15130272

申请日：2016-04-15

Applicant: Applied Materials, Inc.

Inventor： John J. Mazzocco ,  Nir Merry

IPC: H01L21/67 ,  E05C19/16 ,  H01L21/673

Abstract: A substrate carrier door assembly including relatively high sealing force that can be modulated. Substrate carrier door assembly includes a carrier door configured to seal to a carrier body, a first attraction member on the carrier body, and a second attraction member on the carrier door. Attraction members are selected from a group of a magnetic material and a permanent magnet. Substrate carrier door assembly includes a magnetic field generator energizable to reduce attraction force between the attraction members making the carrier door relatively easier to remove, yet providing enhanced sealing when not energized. Substrate carriers including the substrate carrier door assembly and methods of processing substrates are provided. A substrate carrier including a port configured to allow gas to be injected into, or removed from, a carrier chamber, and a magnetic port seal is also disclosed, as are numerous other aspects.

公开(公告)号：US20160340947A1

公开(公告)日：2016-11-24

申请号：US15130272

申请日：2016-04-15

Applicant: Applied Materials, Inc.

Inventor： John J. Mazzocco ,  Nir Merry

IPC: E05C19/16 ,  H01L21/673

CPC classification number: E05C19/166 ,  H01L21/67373 ,  H01L21/67376 ,  H01L21/67393

Abstract: A substrate carrier door assembly including relatively high sealing force that can be modulated. Substrate carrier door assembly includes a carrier door configured to seal to a carrier body, a first attraction member on the carrier body, and a second attraction member on the carrier door. Attraction members are selected from a group of a magnetic material and a permanent magnet. Substrate carrier door assembly includes a magnetic field generator energizable to reduce attraction force between the attraction members making the carrier door relatively easier to remove, yet providing enhanced sealing when not energized. Substrate carriers including the substrate carrier door assembly and methods of processing substrates are provided. A substrate carrier including a port configured to allow gas to be injected into, or removed from, a carrier chamber, and a magnetic port seal is also disclosed, as are numerous other aspects.

Abstract translation: 包括可以被调制的相对高的密封力的基板载体门组件。 基板承载门组件包括：承载门，其构造成密封到承载体，载体主体上的第一吸引构件和载体门上的第二吸引构件。 吸引构件选自一组磁性材料和永磁体。 基板载体门组件包括能够激励的磁场发生器，以减少吸引构件之间的吸引力，使吸引构件相对更容易去除，同时在不通电时提供增强的密封。 提供了包括基板载体门组件的基板载体和处理基板的方法。 还公开了一种衬底载体，其包括被配置为允许气体被注入或移除载体室的端口和磁端口密封件。