发明申请
- 专利标题: CURRENT MEASURING MODULE USING INSPECTION SUBSTRATE AND INSPECTION SUBSTRATE
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申请号: US16245154申请日: 2019-01-10
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公开(公告)号: US20190219627A1公开(公告)日: 2019-07-18
- 发明人: Masaki TOMITA , Hiroyuki TAKENAKA , Mitsutoshi YAHAGI
- 申请人: EBARA CORPORATION
- 优先权: JP2018-006570 20180118
- 主分类号: G01R31/04
- IPC分类号: G01R31/04 ; G01R1/073
摘要:
A current measuring module for measuring a current flowing through the substrate holder using an inspection substrate is provided. The substrate holder includes a plurality of holder electric contacts. The plurality of holder electric contacts contact a substrate to supply the held substrate with a current. The substrate holder holds the inspection substrate for measuring the current flowing through the substrate holder. The plurality of holder electric contacts contact a plurality of respective independent substrate electric contacts disposed on the inspection substrate. The inspection substrate includes a plurality of measurement points connected to the plurality of respective substrate electric contacts with wirings and substrate side connectors electrically connected to the plurality of measurement points. The current measuring module includes a plurality of inspection probes configured to contact the plurality of respective measurement points on the inspection substrate.
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