Invention Application
- Patent Title: SHIELDED FOLDED CIRCUIT BOARD
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Application No.: US16399825Application Date: 2019-04-30
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Publication No.: US20190261504A1Publication Date: 2019-08-22
- Inventor: Tin Poay Chuah , Yew San Lim , Boon Ping Koh , Phaik Kiau Tan
- Applicant: Intel Corporation
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/14 ; H05K3/36

Abstract:
A folded circuit board includes a first circuit board and a second circuit board. The first circuit board and second circuit board are coupled together through a flexible interconnect. One or more folding guides are coupled to one of the first circuit board or second circuit board. The one or more folding guides extend beyond a first edge of the one of the first circuit board or second circuit board. The one or more folding guides include a curved sidewall configured to guide the flexible interconnect when the first circuit board is folded over the second circuit board. In one embodiment, the one or more folding guides are grounded to reduce EMI emissions.
Public/Granted literature
- US10939540B2 Shielded folded circuit board Public/Granted day:2021-03-02
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