- 专利标题: WURTZITE HETEROEPITAXIAL STRUCTURES WITH INCLINED SIDEWALL FACETS FOR DEFECT PROPAGATION CONTROL IN SILICON CMOS-COMPATIBLE SEMICONDUCTOR DEVICES
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申请号: US16431646申请日: 2019-06-04
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公开(公告)号: US20190287789A1公开(公告)日: 2019-09-19
- 发明人: Sansaptak Dasgupta , Han Wui Then , Benjamin Chu-Kung , Marko Radosavljevic , Sanaz K. Gardner , Seung Hoon Sung , Ravi Pillarisetty , Robert S. Chau
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; H01L29/78 ; H01L29/778 ; H01L29/267 ; H01L29/20 ; H01L29/16 ; H01L29/06 ; H01L29/04 ; H01L27/06 ; H01L21/8252
摘要:
III-N semiconductor heterostructures including a raised III-N semiconductor structures with inclined sidewall facets are described. In embodiments, lateral epitaxial overgrowth favoring semi-polar inclined sidewall facets is employed to bend crystal defects from vertical propagation to horizontal propagation. In embodiments, arbitrarily large merged III-N semiconductor structures having low defect density surfaces may be overgrown from trenches exposing a (100) surface of a silicon substrate. III-N devices, such as III-N transistors, may be further formed on the raised III-N semiconductor structures while silicon-based transistors may be formed in other regions of the silicon substrate.
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