Invention Application
- Patent Title: DUAL TEMPERATURE HEATER
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Application No.: US16443185Application Date: 2019-06-17
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Publication No.: US20190304825A1Publication Date: 2019-10-03
- Inventor: Dale R. Du BOIS , Juan Carlos ROCHA-ALVAREZ , Sanjeev BALUJA , Ganesh BALASUBRAMANIAN , Lipyeow YAP , Jianhua ZHOU , Thomas NOWAK
- Applicant: Applied Materials, Inc.
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/687 ; H01L21/67 ; H01L21/324 ; B05C13/00 ; H01J37/32 ; C23C16/458

Abstract:
A method and apparatus for heating a substrate in a chamber are provided. an apparatus for positioning a substrate in a processing chamber. In one embodiment, the apparatus comprises a substrate support assembly having a support surface adapted to receive the substrate and a plurality of centering fingers for supporting the substrate at a distance parallel to the support surface and for centering the substrate relative to a reference axis substantially perpendicular to the support surface. The plurality of the centering fingers are movably disposed along a periphery of the support surface, and each of the plurality of centering fingers comprises a first end portion for either contacting or supporting a peripheral edge of the substrate.
Public/Granted literature
- US11133210B2 Dual temperature heater Public/Granted day:2021-09-28
Information query
IPC分类: