发明申请
- 专利标题： DUAL TEMPERATURE HEATER
-
申请号： US16443185申请日： 2019-06-17
-
公开(公告)号： US20190304825A1公开(公告)日： 2019-10-03
- 发明人: Dale R. Du BOIS , Juan Carlos ROCHA-ALVAREZ , Sanjeev BALUJA , Ganesh BALASUBRAMANIAN , Lipyeow YAP , Jianhua ZHOU , Thomas NOWAK
- 申请人： Applied Materials, Inc.
- 主分类号： H01L21/68
- IPC分类号： H01L21/68 ; H01L21/687 ; H01L21/67 ; H01L21/324 ; B05C13/00 ; H01J37/32 ; C23C16/458
摘要：
A method and apparatus for heating a substrate in a chamber are provided. an apparatus for positioning a substrate in a processing chamber. In one embodiment, the apparatus comprises a substrate support assembly having a support surface adapted to receive the substrate and a plurality of centering fingers for supporting the substrate at a distance parallel to the support surface and for centering the substrate relative to a reference axis substantially perpendicular to the support surface. The plurality of the centering fingers are movably disposed along a periphery of the support surface, and each of the plurality of centering fingers comprises a first end portion for either contacting or supporting a peripheral edge of the substrate.
公开/授权文献
- US11133210B2 Dual temperature heater 公开/授权日：2021-09-28
信息查询
IPC分类:
