- 专利标题： SUBSTRATE PROCESSING APPARATUS
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申请号： US16410378申请日： 2019-05-13
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公开(公告)号： US20190355594A1公开(公告)日： 2019-11-21
- 发明人: Hidetatsu ISOKAWA , Koji MAEDA , Xu HAIYANG , Shun EHARA
- 申请人： EBARA CORPORATION
- 优先权： JP2018-096411 20180518
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; B24B37/34 ; B08B3/04 ; H01L21/677 ; H01L21/687
摘要：
A mechanism that conveys a substrate is cleaned in a cleaning unit. A substrate processing apparatus that includes a substrate polishing device and a substrate cleaning unit is disclosed. The substrate cleaning unit includes a cleaning module and a cleaning unit conveyance mechanism. The cleaning unit conveyance mechanism includes a hand and a hand open/close mechanism. The substrate processing apparatus further includes a hand cleaning unit. The hand cleaning unit includes a hand cleaning tank and a cleaning liquid injection mechanism.
公开/授权文献
- US11173523B2 Substrate processing apparatus 公开/授权日：2021-11-16
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