SUBSTRATE PROCESSING APPARATUS
    1.
    发明申请

    公开(公告)号:US20190355594A1

    公开(公告)日:2019-11-21

    申请号:US16410378

    申请日:2019-05-13

    申请人: EBARA CORPORATION

    摘要: A mechanism that conveys a substrate is cleaned in a cleaning unit. A substrate processing apparatus that includes a substrate polishing device and a substrate cleaning unit is disclosed. The substrate cleaning unit includes a cleaning module and a cleaning unit conveyance mechanism. The cleaning unit conveyance mechanism includes a hand and a hand open/close mechanism. The substrate processing apparatus further includes a hand cleaning unit. The hand cleaning unit includes a hand cleaning tank and a cleaning liquid injection mechanism.

    SUBSTRATE PROCESSING APPARATUS
    2.
    发明申请

    公开(公告)号:US20210394332A1

    公开(公告)日:2021-12-23

    申请号:US17041734

    申请日:2020-03-04

    申请人: EBARA CORPORATION

    摘要: A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.