Invention Application
- Patent Title: System and Method for Characterization of Buried Defects
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Application No.: US16189497Application Date: 2018-11-13
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Publication No.: US20200090969A1Publication Date: 2020-03-19
- Inventor: Jason Kirkwood , Jan Lauber
- Applicant: KLA-Tencor Corporation
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G06T7/00 ; G06K9/62 ; G06T7/50 ; G06T7/60

Abstract:
A system for defect detection and analysis is provided. The system may include an inspection sub-system and a controller including a memory and one or more processors. The inspection sub-system may include an illumination source and one or more detectors configured to acquire control patch images of defects of a control specimen along one or more detector channels. The one or more processors may be configured to train a defect classifier using the control patch images and known parameters associated with the defects of the control specimen. The inspection sub-system may be further configured to acquire patch images of identified defects on an additional specimen. The one or more processors may be configured to determine parameters of the identified defects using the defect classifier.
Public/Granted literature
- US10854486B2 System and method for characterization of buried defects Public/Granted day:2020-12-01
Information query
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