公开(公告)号：US10854486B2

公开(公告)日：2020-12-01

申请号：US16189497

申请日：2018-11-13

Applicant: KLA-Tencor Corporation

Inventor： Jason Kirkwood ,  Jan Lauber

IPC: H01L21/67 ,  G06T7/00 ,  G06K9/62 ,  G06T7/50 ,  G06T7/60

Abstract: A system for defect detection and analysis is provided. The system may include an inspection sub-system and a controller including a memory and one or more processors. The inspection sub-system may include an illumination source and one or more detectors configured to acquire control patch images of defects of a control specimen along one or more detector channels. The one or more processors may be configured to train a defect classifier using the control patch images and known parameters associated with the defects of the control specimen. The inspection sub-system may be further configured to acquire patch images of identified defects on an additional specimen. The one or more processors may be configured to determine parameters of the identified defects using the defect classifier.

公开(公告)号：US10605744B2

公开(公告)日：2020-03-31

申请号：US15865130

申请日：2018-01-08

Applicant: KLA-Tencor Corporation

Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

IPC: G01N21/95 ,  H01L21/66 ,  G01N21/88

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

公开(公告)号：US20200090969A1

公开(公告)日：2020-03-19

申请号：US16189497

申请日：2018-11-13

Applicant: KLA-Tencor Corporation

Inventor： Jason Kirkwood ,  Jan Lauber

IPC: H01L21/67 ,  G06T7/00 ,  G06K9/62 ,  G06T7/50 ,  G06T7/60

Abstract: A system for defect detection and analysis is provided. The system may include an inspection sub-system and a controller including a memory and one or more processors. The inspection sub-system may include an illumination source and one or more detectors configured to acquire control patch images of defects of a control specimen along one or more detector channels. The one or more processors may be configured to train a defect classifier using the control patch images and known parameters associated with the defects of the control specimen. The inspection sub-system may be further configured to acquire patch images of identified defects on an additional specimen. The one or more processors may be configured to determine parameters of the identified defects using the defect classifier.

公开(公告)号：US20130250287A1

公开(公告)日：2013-09-26

申请号：US13900465

申请日：2013-05-22

Applicant: KLA-Tencor Corporation

Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

IPC: G01N21/95

CPC classification number: G01N21/9501 ,  G01N2021/887 ,  H01L22/12

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括通过使用检查系统的第一和第二光学状态的检查系统扫描晶片来产生晶片的输出。 第一和第二光学状态由检查系统的至少一个光学参数的不同值来定义。 该方法还包括使用使用第二光学状态产生的输出使用第一光学状态产生的输出和晶片的第二图像数据为晶片产生第一图像数据。 此外，该方法包括将第一图像数据和对应于晶片上基本相同位置的第二图像数据组合，从而产生用于晶片的附加图像数据。 该方法还包括使用附加图像数据检测晶片上的缺陷。

公开(公告)号：US20180202943A1

公开(公告)日：2018-07-19

申请号：US15865130

申请日：2018-01-08

Applicant: KLA-Tencor Corporation

Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

IPC: G01N21/95 ,  H01L21/66 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N2021/887 ,  H01L22/12

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

公开(公告)号：US09880107B2

公开(公告)日：2018-01-30

申请号：US13900465

申请日：2013-05-22

Applicant: KLA-Tencor Corporation

Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

IPC: G01N21/00 ,  G01N21/95 ,  H01L21/66 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N2021/887 ,  H01L22/12

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.