Invention Application
- Patent Title: ELECTRICALLY CONDUCTIVE ADHESIVE
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Application No.: US16497042Application Date: 2017-05-09
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Publication No.: US20200095479A1Publication Date: 2020-03-26
- Inventor: Jing Fang , Dong Yang , Jeffrey W. McCutcheon
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- International Application: PCT/CN2017/083574 WO 20170509
- Main IPC: C09J9/02
- IPC: C09J9/02 ; C09J201/02

Abstract:
An electrically conductive adhesive layer is described. The adhesive layer includes an adhesive material and pluralities of electrically conductive at least first and second particles. The adhesive layer may have a thickness less than about 35 micrometers and an electrical resistance in the thickness direction of less than about 30 milliohms. A total volume of the pluralities of particles may be greater than 40% of a total volume of the adhesive layer. The first and second particles may have different shapes.
Public/Granted literature
- US11168235B2 Electrically conductive adhesive Public/Granted day:2021-11-09
Information query
IPC分类: