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公开(公告)号：US11802221B2
公开(公告)日：2023-10-31
申请号：US17495409
申请日：2021-10-06
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jing Fang , Dong Yang , Jeffrey W. McCutcheon
IPC: H01B1/22 , C09J9/02 , C09J201/02
CPC classification number: C09J9/02 , C09J201/02 , H01B1/22 , C09J2301/302 , C09J2301/312 , C09J2301/314
Abstract: An electrically conductive adhesive layer includes an adhesive material; a plurality of electrically conductive dendritic first particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 20 micrometers to about 40 micrometers; and a plurality of electrically conductive substantially planar second particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 40 micrometers to about 70 micrometers. The adhesive layer has an average thickness in a range from about 15 micrometers to about 35 micrometers, an electrical resistance in a thickness direction of less than about 30 milliohms, and a peel strength of at least 0.1 N/mm from a stainless steel surface after a dwell time of about 20 minutes at 22° C.
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公开(公告)号：US20230110790A1
公开(公告)日：2023-04-13
申请号：US17992224
申请日：2022-11-22
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jeongwan Choi , Jeffrey W. McCutcheon , Marina M. Kaplun , Steven Y. Yu , Jinbae Kim
Abstract: An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.
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公开(公告)号：US20230049873A1
公开(公告)日：2023-02-16
申请号：US17792872
申请日：2021-01-15
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Zhonghua Lu , Jeffrey W. McCutcheon , Sergei A. Manuilov , Joseph B. Eckel , Aaron K. Nienaber , Michael S. Graff , Ronald D. Jesme , Steven H. Kong , Shane P. White
Abstract: An electrically conductive adhesive layer includes a plurality of particles dispersed between opposing first and second major surfaces of the electrically conductive adhesive layer. The first and second major surfaces are spaced apart a distance D. The particles are agglomerated so as to form a plurality of substantially continuous layers of particles generally extending along orthogonal first and second directions and arranged along a third direction. Each substantially continuous layer of particles has a length L along the first direction from a first to an opposing second edge of the electrically conductive adhesive layer and a width W along the second direction extending from the first to the second major surface. L/D ≥ 100. At least some of the particles are electrically conductive.
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公开(公告)号：US20200095479A1
公开(公告)日：2020-03-26
申请号：US16497042
申请日：2017-05-09
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jing Fang , Dong Yang , Jeffrey W. McCutcheon
IPC: C09J9/02 , C09J201/02
Abstract: An electrically conductive adhesive layer is described. The adhesive layer includes an adhesive material and pluralities of electrically conductive at least first and second particles. The adhesive layer may have a thickness less than about 35 micrometers and an electrical resistance in the thickness direction of less than about 30 milliohms. A total volume of the pluralities of particles may be greater than 40% of a total volume of the adhesive layer. The first and second particles may have different shapes.
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公开(公告)号：US20160333232A1
公开(公告)日：2016-11-17
申请号：US15112595
申请日：2015-01-21
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jeongwan Choi , Jeffrey W. McCutcheon
CPC classification number: C09J9/02 , C09J7/21 , C09J7/26 , C09J7/30 , C09J2201/122 , C09J2201/602 , C09J2201/606 , C09J2203/326 , C09J2400/263 , C09J2433/00 , C09J2467/006
Abstract: An electrically conductive, single-sided tape includes a conductive adhesive layer, which includes a first conductive porous substrate having a plurality of passageways and an adhesive material positioned within at least a portion of the passageways; and a second conductive porous substrate positioned adjacent the conductive adhesive layer. Optionally, the electrically conductive, single-sided tape may include an opaque coating adjacent to a major surface of the second conductive porous substrate. Optionally, the adhesive material may include a plurality of conductive particles dispersed within the adhesive material.
Abstract translation: 导电单面胶带包括导电粘合剂层，其包括具有多个通道的第一导电多孔基材和位于通道的至少一部分内的粘合材料; 以及邻近所述导电粘合剂层定位的第二导电多孔基材。 可选地，导电单面胶带可以包括与第二导电多孔基材的主表面相邻的不透明涂层。 可选地，粘合剂材料可以包括分散在粘合剂材料内的多个导电颗粒。
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Patent Agency Ranking
公开(公告)号：US20240414845A1
公开(公告)日：2024-12-12
申请号：US18698113
申请日：2022-10-05
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jeongwan Choi , Jong-Pil Kim , Jinbae Kim , Jeffrey W. McCutcheon
Abstract: The disclosure relates to an integral electronic stack and a multi-layer stack. Specifically, according to an embodiment of the disclosure, there is provided an integral electronic stack for grounding an electrically conductive component in which passive intermodulation (PIM) is reduced, wherein the integral electronic stack includes a first integral stack and a second integral stack, the first integral stack being bonded to the second integral stack, wherein the first integral stack includes: a first board which is substantially rigid; a first electrically conductive layer which is disposed on at least part of a first main surface of the first board; a first electrically conductive adhesive layer and a second electrically conductive adhesive layer; and a first electrically conductive film which is disposed between the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, and is bonded to the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, respectively, the first electrically conductive adhesive layer and the second electrically conductive adhesive layer including a plurality of electrically conductive elements substantially distributed in an electrically insulative material, wherein the first electrically conductive adhesive layer bonds the first electrically conductive film to the one or more first electrically conductive layer.
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公开(公告)号：US20240254371A1
公开(公告)日：2024-08-01
申请号：US18560465
申请日：2021-05-26
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Hongyu Gan , Yan Wu , Jie Huang , Jing Fang , Jeffrey W. McCutcheon
CPC classification number: C09J9/02 , C09J7/21 , C09J7/22 , C09J2301/312 , C09J2301/314
Abstract: A tape includes an electrically conductive adhesive first layer having opposite outermost first and second major surfaces. The first layer includes an electrically conductive porous medium and an adhesive disposed in, and extending through a thickness of, the porous medium to define at the first major surface, first regions of exposed adhesive and first regions of exposed porous medium and to define at the second major surface, second regions of exposed adhesive and second regions of exposed porous medium. The second major surface has a higher fraction of exposed porous medium than the first major surface. The porous medium can be a nonwoven fabric and the regions of exposed porous medium can be regions of exposed fibers.
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公开(公告)号：US20230235200A1
公开(公告)日：2023-07-27
申请号：US18125818
申请日：2023-03-24
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jeongwan Choi , Jeffrey W. McCutcheon , Marina M. Kaplun , Steven Y. Yu , Jinbae Kim
Abstract: An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.
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公开(公告)号：US20190040954A1
公开(公告)日：2019-02-07
申请号：US16074784
申请日：2017-01-27
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Wei Wei , Liang Chen , Jing Fang , Jeffrey W. McCutcheon
Abstract: The present disclosure provides a compressible gasket, an electronic product comprising the compressible gasket and a method for preparing the compressible gasket. The compressible gasket of the present disclosure comprises an open-cell foam matrix and a filling medium which fills and is cured in the open cells of the open-cell foam, the filling medium comprising a curable adhesive and one or more types of micrometer particles dispersed therein. The one or more types of micrometer particles comprise at least one of thermally conductive micrometer particles and thermally and electrically conductive micrometer particles, and optionally comprise at least one of flame retardant micrometer particles, electrically conductive micrometer particles and electromagnetic wave absorption micrometer particles. The compressible gasket of the present invention can provide shock and vibration absorption and sealing functions and also meet requirements on system thermal management design and/or electromagnetic compatibility design.
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公开(公告)号：US11168235B2
公开(公告)日：2021-11-09
申请号：US16497042
申请日：2017-05-09
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jing Fang , Dong Yang , Jeffrey W. McCutcheon
IPC: H01B1/22 , C09J9/00 , C09J9/02 , C09J201/02
Abstract: An electrically conductive adhesive layer is described. The adhesive layer includes an adhesive material and pluralities of electrically conductive at least first and second particles. The adhesive layer may have a thickness less than about 35 micrometers and an electrical resistance in the thickness direction of less than about 30 milliohms. A total volume of the pluralities of particles may be greater than 40% of a total volume of the adhesive layer. The first and second particles may have different shapes.
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