- 专利标题: INDUCTOR/CORE ASSEMBLIES FOR INTEGRATED CIRCUITS
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申请号: US16631681申请日: 2017-09-20
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公开(公告)号: US20200152855A1公开(公告)日: 2020-05-14
- 发明人: Kevin L. Lin , Nicholas James Harold McKubre , Han Wui Then
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 国际申请: PCT/US2017/052390 WO 20170920
- 主分类号: H01L41/09
- IPC分类号: H01L41/09 ; H01F27/30 ; H01L49/02 ; H01F27/24
摘要:
Disclosed herein are inductor/core assemblies for integrated circuits (ICs), as well as related structures, methods, and devices. In some embodiments, an IC structure may include an inductor and a magnetic core in an interior of the inductor. The magnetic core may be movable perpendicular to a plane of the inductor.
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