Invention Application
- Patent Title: METHOD FOR DETECTING A THINNING OF THE SEMICONDUCTOR SUBSTRATE OF AN INTEGRATED CIRCUIT FROM ITS BACK FACE AND CORRESPONDING INTEGRATED CIRCUIT
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Application No.: US16747995Application Date: 2020-01-21
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Publication No.: US20200160916A1Publication Date: 2020-05-21
- Inventor: Pascal FORNARA , Christian RIVERO
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Rousset
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@59cba78a
- Main IPC: G11C16/22
- IPC: G11C16/22 ; G06F21/87 ; H01L29/78 ; H01L27/115 ; H01L23/00 ; H01L21/66 ; H01L21/8238 ; H01L21/8234 ; H01L21/74 ; H01L21/311
Abstract:
The thinning of a semiconductor substrate of an integrated circuit from a back face is detected using the measurement of a physical quantity representative of the resistance between the ends of two electrically-conducting contacts situated at an interface between an insulating region and an underlying substrate region. The two electrically-conducting contacts extend through the insulating region to reach the underlying substrate region.
Information query
