Invention Application
- Patent Title: PRINTED CIRCUIT BOARD
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Application No.: US16664113Application Date: 2019-10-25
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Publication No.: US20200163228A1Publication Date: 2020-05-21
- Inventor: Sa-Yong LEE , Tae-Hong MIN
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@12143cf4
- Main IPC: H05K3/36
- IPC: H05K3/36 ; H05K1/18 ; H01L23/498

Abstract:
A printed circuit board includes: an insulating material; a metal layer disposed on a first surface of the insulating material and including an opening; a pad disposed along a second surface of the insulating material; a via hole penetrating through the insulating material and extending from the pad to the opening; and a conductor disposed along the opening and the via hole. A diameter of a portion of the via hole adjacent to the opening is smaller than a diameter of a portion of the opening adjacent to the via hole.
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