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公开(公告)号：US20170086290A1
公开(公告)日：2017-03-23
申请号：US15099212
申请日：2016-04-14
发明人： Keun-Yong LEE , Jun-Young KIM , Sa-Yong LEE , Sang-Hyun SHIN
CPC分类号： H05K1/0366 , H05K2201/0248 , H05K2201/0251 , H05K2201/026
摘要： A prepreg, a printed circuit board and a method of manufacturing the same are provided. A prepreg includes a core layer including nanofibers having a thickness in a range of 10 to 100 nm, a first insulating layer on a first surface of the core layer, and a second insulating layer on a second surface of the core layer.
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公开(公告)号：US20200170110A1
公开(公告)日：2020-05-28
申请号：US16661051
申请日：2019-10-23
发明人： Seon-Ha KANG , Sa-Yong LEE , Mi-Sun HWANG , Ju-Ho KIM
摘要： A printed circuit board is provided. The printed circuit board includes an insulating material, and a circuit comprising a first region that partially penetrates the insulating material, and a second region formed on the first region and that protrudes from an upper portion of the insulating material, the first region includes a first electroplating layer and a first electroless plating layer that are formed between the insulating material and the first electroplating layer.
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公开(公告)号：US20200176386A1
公开(公告)日：2020-06-04
申请号：US16537923
申请日：2019-08-12
发明人： Ho-Hyung HAM , Sa-Yong LEE , Ju-Ho KIM
IPC分类号： H01L23/538 , H01L23/00 , H01L21/48
摘要： Provided is a printed circuit board including a laminate that is formed by vertically stacking a plurality of insulating layers including a rigid insulating layer, a flexible insulating layer having a first region in vertical contact with at least one of the plurality of insulating layers and a second region located on an outer side of the laminate, and a first electronic element embedded in the flexible insulating layer.
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公开(公告)号：US20200163228A1
公开(公告)日：2020-05-21
申请号：US16664113
申请日：2019-10-25
发明人： Sa-Yong LEE , Tae-Hong MIN
IPC分类号： H05K3/36 , H05K1/18 , H01L23/498
摘要： A printed circuit board includes: an insulating material; a metal layer disposed on a first surface of the insulating material and including an opening; a pad disposed along a second surface of the insulating material; a via hole penetrating through the insulating material and extending from the pad to the opening; and a conductor disposed along the opening and the via hole. A diameter of a portion of the via hole adjacent to the opening is smaller than a diameter of a portion of the opening adjacent to the via hole.
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