Invention Application
- Patent Title: DIE CONTACT FORMATIONS
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Application No.: US16629120Application Date: 2017-07-26
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Publication No.: US20200164645A1Publication Date: 2020-05-28
- Inventor: Michael W Cumbie , Anthony Fuller , Chien-Hua Chen , Zhen Yi Li
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2017/044027 WO 20170726
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; B41J2/045

Abstract:
Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel.
Public/Granted literature
- US11135839B2 Die contact formations Public/Granted day:2021-10-05
Information query
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