公开(公告)号：US20200164645A1

公开(公告)日：2020-05-28

申请号：US16629120

申请日：2017-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W Cumbie ,  Anthony Fuller ,  Chien-Hua Chen ,  Zhen Yi Li

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/045

Abstract: Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel.

公开(公告)号：US11135839B2

公开(公告)日：2021-10-05

申请号：US16629120

申请日：2017-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W Cumbie ,  Anthony Fuller ,  Chien-Hua Chen ,  Zhen Yi Li

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/045

Abstract: Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel.