Invention Application
- Patent Title: METHOD OF TESTING AN INTERCONNECTION SUBSTRATE AND APPARATUS FOR PERFORMING THE SAME
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Application No.: US16437675Application Date: 2019-06-11
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Publication No.: US20200166563A1Publication Date: 2020-05-28
- Inventor: Mee-Hyun LIM , Sung-Yeol KIM , Seong-Keun CHO , Won-Don JOO , Jae-Hong KIM , Taek-Jin KIM , Kyung-Min LEE , Sang-Min LEE
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@40ac7048
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R31/308 ; G01R1/07 ; G01N21/21

Abstract:
In a method of testing an interconnection substrate, a blocking condition of a reference light reflected from a probe having an intrinsic optical characteristic may be set. An electric field emitted from a test interconnection substrate having a plurality of circuits may change the intrinsic optical characteristics of the probe into test optical characteristics. Light may be irradiated to the probe having the test optical characteristics. The reference light reflected from the probe having the test optical characteristic may be blocked in accordance with the blocking condition. The remaining reflected light that may be due to an abnormal circuit may be detected.
Public/Granted literature
- US11047901B2 Method of testing an interconnection substrate and apparatus for performing the same Public/Granted day:2021-06-29
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