Invention Application
- Patent Title: COPPER PASSIVATION
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Application No.: US16209513Application Date: 2018-12-04
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Publication No.: US20200173013A1Publication Date: 2020-06-04
- Inventor: Luu Thanh Nguyen , Mahmud Halim Chowdhury , Ashok Prabhu , Anindya Poddar
- Applicant: Texas Instruments Incorporated
- Main IPC: C23C14/12
- IPC: C23C14/12 ; C23F11/10 ; H01L21/768 ; H01L21/3205 ; H01L21/288
Abstract:
In a described example, a method for passivating a copper structure includes: passivating a surface of the copper structure with a copper corrosion inhibitor layer; and depositing a protection overcoat layer with a thickness less than 35 μm on a surface of the copper corrosion inhibitor layer.
Public/Granted literature
- US11021786B2 Copper passivation Public/Granted day:2021-06-01
Information query
IPC分类:
