Invention Application
- Patent Title: PHOTOSENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
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Application No.: US16783350Application Date: 2020-02-06
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Publication No.: US20200183274A1Publication Date: 2020-06-11
- Inventor: Naohiro TANGO , Akiyoshi GOTO , Keiyu O , Kazuhiro Marumo , Ryo NISHIO , Akira TAKADA
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6e4e2c56
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/039 ; C08L25/08 ; G03F7/20 ; G03F7/32
Abstract:
A photosensitive resin composition includes a resin, a photoacid generator, a solvent, and a low-molecular-weight ester compound, in which low-molecular-weight ester compound has alkali degradability and has a molecular weight of less than 1,500, and a content of the low-molecular-weight ester compound is from 0.1% by mass to 6% by mass with respect to the total solid content of the composition.
Public/Granted literature
- US2657545A Refrigerated display case Public/Granted day:1953-11-03
Information query
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