Invention Application
- Patent Title: ETCHANT COMPOSITION FOR ETCHING METAL FILM AND METHOD OF FORMING PATTERN USING THE SAME
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Application No.: US16728276Application Date: 2019-12-27
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Publication No.: US20200208052A1Publication Date: 2020-07-02
- Inventor: Kihun SONG , Jungmin OH , Hyosan LEE , Daehyuk CHUNG , Minjung KIM , Hyojoong YOON
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Iksan-si
- Assignee: DONGWOO FINE-CHEM Co., Ltd.
- Current Assignee: DONGWOO FINE-CHEM Co., Ltd.
- Current Assignee Address: KR Iksan-si
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@12e4d4af
- Main IPC: C09K13/06
- IPC: C09K13/06 ; H01L21/311

Abstract:
An etchant composition for etching a metal film and a method of forming a pattern, the etchant composition including an acid etching agent, the acid etching agent including an inorganic acid or an organic acid; an auxiliary oxidant, the auxiliary oxidant including hydrogen peroxide or an amine oxide compound; and an organic solvent, the organic solvent including a compound having an unshared electron pair, and having a dielectric constant of about 17 to about 80.
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