发明申请
- 专利标题： UNIFORM VIA PAD STRUCTURE
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申请号： US16724247申请日： 2019-12-21
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公开(公告)号： US20200219803A1公开(公告)日： 2020-07-09
- 发明人: Kuiwon KANG , Chin-Kwan KIM , Aniket PATIL , Jaehyun YEON
- 申请人： QUALCOMM Incorporated
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/48
摘要：
Examples herein provide more integrated circuit packages that allow direct bonding of semiconductor chips to the package, smaller line/spacing of traces, and uniform vias with no capture or cover pads. For example, an integrated circuit (IC) package may include a plurality of pads and a plurality of traces on a substrate with at least two of the plurality of traces located between two of the plurality of pads, and a dielectric layer that completely covers the plurality of traces and partially covers the plurality of pads.
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