公开(公告)号：US20230093681A1

公开(公告)日：2023-03-23

申请号：US17479691

申请日：2021-09-20

Applicant: QUALCOMM Incorporated

Inventor： Hyunchul CHO ,  Kun FANG ,  Jaehyun YEON ,  Suhyung HWANG

IPC: H01L21/768 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00

Abstract: A package that includes a substrate, a first integrated device coupled to a first surface of the substrate, and a second integrated device coupled to a second surface of the substrate. The substrate includes at least one dielectric layer, a first plurality of high-density interconnects located in the at least one dielectric layer and through a first surface of the at least one dielectric layer; a second plurality of high-density interconnects located in the at least one dielectric.

公开(公告)号：US20210345492A1

公开(公告)日：2021-11-04

申请号：US17093920

申请日：2020-11-10

Applicant: QUALCOMM Incorporated

Inventor： Jaehyun YEON ,  Suhyung HWANG ,  Rajneesh KUMAR ,  Jeahyeong HAN

IPC: H05K1/18 ,  H05K1/02

Abstract: A device that includes a flexible printed circuit board (PCB), a package coupled to the flexible PCB, a first antenna device coupled to the flexible PCB, and a second antenna device coupled to the flexible PCB. The first antenna device is configured to transmit and receive a first signal having a first frequency. The second antenna device is configured to transmit and receive a second signal having a second frequency. The first antenna device may be coupled to a second surface of the flexible PCB, and the second antenna device is coupled to the second surface of the flexible PCB. The first antenna device may be coupled to a second surface of the flexible PCB, and the second antenna device is coupled to a first surface of the flexible PCB.

公开(公告)号：US20210175152A1

公开(公告)日：2021-06-10

申请号：US16704789

申请日：2019-12-05

Applicant: QUALCOMM Incorporated

Inventor： Chaoqi ZHANG ,  Rajneesh KUMAR ,  Li-Sheng WENG ,  Darryl Sheldon JESSIE ,  Suhyung HWANG ,  Jeahyeong HAN ,  Xiaoming CHEN ,  Jaehyun YEON

IPC: H01L23/48 ,  H01L23/31 ,  H01L21/67 ,  H01L21/56

Abstract: A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located over the substrate such that the encapsulation layer encapsulates the integrated device.

公开(公告)号：US20230155273A1

公开(公告)日：2023-05-18

申请号：US17981176

申请日：2022-11-04

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong HAN ,  Rajneesh KUMAR ,  Suhyung HWANG ,  Jaehyun YEON ,  Mohammad Ali TASSOUDJI ,  Darryl Sheldon JESSIE ,  Ameya GALINDE

IPC: H01Q1/22 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/36 ,  H01Q1/52 ,  H05K1/18 ,  H05K9/00

CPC classification number: H01Q1/2283 ,  H01L21/565 ,  H01L23/66 ,  H01L23/552 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5387 ,  H01Q1/36 ,  H01Q1/526 ,  H05K1/185 ,  H05K9/0081 ,  H01L21/4857

Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.

公开(公告)号：US20210351488A1

公开(公告)日：2021-11-11

申请号：US16871822

申请日：2020-05-11

Applicant: QUALCOMM Incorporated

Inventor： Chaoqi ZHANG ,  Suhyung HWANG ,  Jaehyun YEON ,  Taesik YANG ,  Jeongil Jay KIM ,  Darryl Sheldon JESSIE ,  Mohammad Ali TASSOUDJI

IPC: H01Q1/12 ,  H05K1/02 ,  H05K3/46 ,  H05K3/00

Abstract: A multi-core broadband printed circuit board (PCB) antenna and methods for fabricating such an antenna are provided. One example antenna implemented with a multi-core PCB generally includes a first core structure, a second core structure disposed above the first core structure, and one or more metal layers disposed above the second core structure or below the first core structure. The first core structure includes a first core layer, a first metal layer disposed below the first core layer, and a second metal layer disposed above the first core layer. The second core structure includes a second core layer, a third metal layer disposed below the second core layer, and a fourth metal layer disposed above the second core layer. The first core layer and the second core layer may have different thicknesses.

公开(公告)号：US20210280959A1

公开(公告)日：2021-09-09

申请号：US16810621

申请日：2020-03-05

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong HAN ,  Rajneesh KUMAR ,  Suhyung HWANG ,  Jaehyun YEON ,  Mohammad Ali TASSOUDJI ,  Darryl Sheldon JESSIE ,  Ameya GALINDE

IPC: H01Q1/22 ,  H01Q1/52 ,  H01Q1/36 ,  H05K1/18 ,  H05K9/00 ,  H01L23/31 ,  H01L23/538 ,  H01L23/66 ,  H01L23/552 ,  H01L21/56

Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.

公开(公告)号：US20230078231A1

公开(公告)日：2023-03-16

申请号：US17476383

申请日：2021-09-15

Applicant: QUALCOMM Incorporated

Inventor： Kun FANG ,  Jaehyun YEON ,  Suhyung HWANG ,  Hyunchul CHO

IPC: H01L23/498 ,  H01L21/48

Abstract: A package that includes a substrate and an integrated device coupled to the substrate. The substrate includes at least one dielectric layer and a plurality of interconnects comprising a first via interconnect and a first trace interconnect, wherein the first via interconnect is directly coupled to the first trace interconnect. The first via interconnect is coupled to the first trace interconnect without an intervening pad interconnect between the first via interconnect and the first trace interconnect.

公开(公告)号：US20210376493A1

公开(公告)日：2021-12-02

申请号：US16886086

申请日：2020-05-28

Applicant: QUALCOMM Incorporated

Inventor： Milind SHAH ,  Chin-Kwan KIM ,  Jaehyun YEON ,  Rajneesh KUMAR ,  Suhyung HWANG

IPC: H01Q23/00 ,  H01Q21/30 ,  H01Q21/06

Abstract: An antenna-in-package (AiP) module is described. The AiP module includes an antenna sub-module. The antenna sub-module is composed of a first package substrate including an antenna side surface having a first group of antennas placed along a first portion of the antenna side surface and a second group of antennas placed along a second portion of the antenna side surface. The first package substrate is composed of a non-linear portion between the first group of antennas and the second group of antennas. The AiP module includes an active circuit sub-module placed on an active side surface of the first package substrate opposite the first group of antennas or the second group of antennas on the antenna side surface of the first package substrate.

公开(公告)号：US20210091017A1

公开(公告)日：2021-03-25

申请号：US16870642

申请日：2020-05-08

Applicant: QUALCOMM Incorporated

Inventor： Jaehyun YEON ,  Suhyung HWANG ,  Chin-Kwan KIM ,  Rajneesh KUMAR ,  Darryl Sheldon JESSIE

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/52 ,  H01Q1/22 ,  H01Q5/307 ,  H01Q9/16

Abstract: A package comprising a substrate, a first antenna device, and an integrated device. The substrate comprising a first surface and a second surface, where the substrate comprises a plurality of interconnects. The first antenna device is coupled to the first surface of the substrate, through a first plurality of solder interconnects. The integrated device is coupled to the second surface of the substrate. The package may include an encapsulation layer located over the second surface of the substrate, where the encapsulation layer encapsulates the integrated device. The package may include a shield formed over a surface of the encapsulation layer, where the shield includes an electromagnetic interference (EMI) shield.

公开(公告)号：US20220068662A1

公开(公告)日：2022-03-03

申请号：US17010693

申请日：2020-09-02

Applicant: QUALCOMM Incorporated

Inventor： Kun FANG ,  Jaehyun YEON ,  Suhyung HWANG ,  Hong Bok WE

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/00

Abstract: A substrate that includes a core layer comprising a first surface and a second surface, at least one first dielectric layer located over a first surface of the core layer, at least one second dielectric layer located over a second surface of the core layer, high-density interconnects located over a surface of the at least one second dielectric layer, interconnects located over the surface of the at least one second dielectric layer, and a solder resist layer located over the surface of the at least one second dielectric layer. A first portion of the solder resist layer that is touching the high-density interconnects includes a first thickness that is equal or less than a thickness of the high-density interconnects. A second portion of the solder resist layer that is touching the interconnects includes a second thickness that is greater than a thickness of the interconnects.