Invention Application
- Patent Title: CARBON-PAD THERMAL-INTERFACE MATERIALS IN MULTI-DIE PACKAGES
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Application No.: US16293163Application Date: 2019-03-05
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Publication No.: US20200286809A1Publication Date: 2020-09-10
- Inventor: Shushan Gong , James C. Matayabas, JR.
- Applicant: Intel Corporation
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L25/11 ; H01L23/367 ; H01L23/538 ; F28F21/02
Abstract:
Multi-die semiconductor device packages include a solder thermal interface material for a processor device, and a carbon-pad thermal interface material for a high-bandwidth memory device. Disparate dice are packaged against a heat sink on the device backsides, and on a semiconductor package substrate on the device active surfaces and metallizations.
Information query
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