- 专利标题： EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
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申请号： US16915282申请日： 2020-06-29
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公开(公告)号： US20200328182A1公开(公告)日： 2020-10-15
- 发明人: Bernd WAIDHAS , Georg SEIDEMANN , Andreas WOLTER , Thomas WAGNER , Stephan Stoeckl , Laurent MILLOU
- 申请人： Intel IP Corporation
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/538 ; H01L23/498 ; H01L23/00 ; H01L21/56 ; H01L25/00 ; H01L21/683
摘要：
An embedded-bridge substrate connector apparatus includes a patterned reference layer to which a first module and a subsequent module are aligned and the two modules are mated at the patterned reference layer. At least one module includes a silicon bridge connector that bridges to two devices, through the patterned reference layer, to the mated module.
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