Invention Application
- Patent Title: FINFET STRUCTURE WITH DOPED REGION
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Application No.: US16995253Application Date: 2020-08-17
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Publication No.: US20200381534A1Publication Date: 2020-12-03
- Inventor: Shahaji B. MORE , Chun-Hsiung TSAI , Cheng-Yi PENG , Shih-Chieh CHANG , Kuo-Feng YU
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/08 ; H01L29/78

Abstract:
Semiconductor structures are provided. The semiconductor structure includes a fin structure protruding from a substrate and a doped region formed in the fin structure. The semiconductor structure further includes a metal gate structure formed across the fin structure and a gate spacer formed on a sidewall of the metal gate structure. The semiconductor structure further includes a source/drain structure formed over the doped region. In addition, the doped region continuously surrounds the source/drain structure and is in direct contact with the gate spacer.
Public/Granted literature
- US11855176B2 FinFET structure with doped region Public/Granted day:2023-12-26
Information query
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