Invention Application
- Patent Title: METHODS AND APPARATUS FOR MICROWAVE PROCESSING OF POLYMER MATERIALS
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Application No.: US16919736Application Date: 2020-07-02
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Publication No.: US20210001520A1Publication Date: 2021-01-07
- Inventor: Tuck Foong KOH , Chien-Kang HSIUNG , Yueh Sheng OW , Felix DENG , Yue CUI , Nuno Yen-Chu CHEN , Ananthkrishna JUPUDI , Clinton GOH , Vinodh RAMACHANDRAN
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Main IPC: B29C35/08
- IPC: B29C35/08 ; H05B6/80 ; H05B6/70 ; H05B6/68
Abstract:
Methods and apparatus for curing a substrate or polymer using variable microwave frequency are provided herein. In some embodiments, a method of curing a substrate or polymer using variable microwave frequency includes: contacting a substrate or polymer with a plurality of predetermined discontinuous microwave energy bandwidths or a plurality of predetermined discontinuous microwave energy frequencies to cure the substrate or polymer.
Information query
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