公开(公告)号：US20230341186A1

公开(公告)日：2023-10-26

申请号：US17730038

申请日：2022-04-26

Applicant: Applied Materials, Inc.

Inventor： Abraham PALATY ,  Vinodh RAMACHANDRAN ,  Shu-Kwan LAU ,  Shainish NELLIKKA ,  Raja Murali DHAMODHARAN ,  Danny D. WANG

IPC: F28D1/02 ,  F28D1/047 ,  F28F1/24

CPC classification number: F28D1/0226 ,  F28D1/0477 ,  F28D1/024 ,  F28F1/24 ,  F28D2001/0286

Abstract: A heating module for a substrate processing chamber includes heating lamps coupled to a reflector plate and a heat exchanger. The heat exchanger cools a gas within the heating module. A fan within the heating module circulates the gas through apertures in the reflector plate to cool the heating bulbs. The gas is cooled by the heat exchanger, and is recirculated. One or more shrouds directs the gas as the gas is being circulated.

公开(公告)号：US20230154766A1

公开(公告)日：2023-05-18

申请号：US17529684

申请日：2021-11-18

Applicant: Applied Materials, Inc.

Inventor： Songjae LEE ,  Avinash SHERVEGAR ,  Srinivasa RANGAPPA ,  Sundarapandiyan SHANMUGAM ,  Ernesto J. ULLOA ,  Vinodh RAMACHANDRAN ,  Abraham PALATY ,  Jaidev RAJARAM

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67017 ,  H01L21/68707

Abstract: Apparatus for processing a substrate are described herein. More specifically, embodiments described herein relate to separate pre-clean process modules and pre-clean control modules coupled to a cluster tool assembly. Each pre-clean process module and each pre-clean control module are connected by a cable conduit which is configured to have power and control cables passing therethrough between the pre-clean process module and the ore-clean control module. A maintenance passage is formed through the cluster tool assembly. Each of a purge gas source, a process gas source, a manometer, an isolation port, and a throttle valve are all accessible from one side of the pre-clean process module.

公开(公告)号：US20220157643A1

公开(公告)日：2022-05-19

申请号：US16952979

申请日：2020-11-19

Applicant: Applied Materials, Inc.

Inventor： Giridhar KAMESH ,  Vinodh RAMACHANDRAN ,  Chaitanya A. PRASAD ,  Mohammad AAMIR ,  Daniel C. GLOVER

IPC: H01L21/687 ,  H01L21/02 ,  H01L21/311

Abstract: Embodiments of the present disclosure generally relate to apparatus for substrate processing, and more specifically to apparatus for rotating substrates and to uses thereof. In an embodiment, an apparatus for rotating a substrate is provided. The apparatus includes a levitatable rotor comprising a plurality of magnets embedded therein, a plurality of gas bearings positioned to levitate the levitatable rotor, and a stator magnetically coupled to the levitatable rotor, the stator for producing a rotating magnetic field. Apparatus for processing a substrate with the apparatus for rotating substrates as well as methods of use are also described.

公开(公告)号：US20220069536A1

公开(公告)日：2022-03-03

申请号：US17009851

申请日：2020-09-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Rajesh Kumar PUTTI ,  Vinodh RAMACHANDRAN ,  Ananthkrishna JUPUDI ,  Lean Wui KOH

IPC: H01S3/041 ,  H01S3/067 ,  H01S3/23 ,  H01S3/042

Abstract: Methods and apparatus for processing a substrate. For example, a processing chamber can include a power source, an amplifier connected to the power source, comprising at least one of a gallium nitride (GaN) transistor or a gallium arsenide (GaAs) transistor, and configured to amplify a power level of an input signal received from the power source to heat a substrate in a process volume, and a cooling plate configured to receive a coolant to cool the amplifier during operation.

公开(公告)号：US20210172806A1

公开(公告)日：2021-06-10

申请号：US17073733

申请日：2020-10-19

Applicant: APPLIED MATERIALS, INC.

Inventor： Ananthkrishna JUPUDI ,  Sai Kumar KODUMURI ,  Vinodh RAMACHANDRAN ,  Prashant AGARWAL ,  Hadi Bin Amir MUHAMMAD

IPC: G01K1/16 ,  G01K1/14 ,  G01K13/00

Abstract: An apparatus for determining temperatures of substrates in microwave and/or vacuum environments. A substrate holder with a plurality of support pins includes a temperature sensor assembly with at least a portion of a surface with a phosphorous coating is configured to be inserted in at least one pin support position from an inner area of the substrate holder and in at least one pin support position from an outer area of the substrate holder. The temperature sensor assembly includes a temperature sensor pin with a spring that is microwave transparent. The temperature sensor pin is made of a material with a thermal conductivity greater than approximately 200 W/mK and a low thermal mass which is microwave transparent. An optical transmission assembly is embedded into at least a portion of the substrate holder to receive light emissions from a surface of the temperature sensor pin.

公开(公告)号：US20210001520A1

公开(公告)日：2021-01-07

申请号：US16919736

申请日：2020-07-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Tuck Foong KOH ,  Chien-Kang HSIUNG ,  Yueh Sheng OW ,  Felix DENG ,  Yue CUI ,  Nuno Yen-Chu CHEN ,  Ananthkrishna JUPUDI ,  Clinton GOH ,  Vinodh RAMACHANDRAN

IPC: B29C35/08 ,  H05B6/80 ,  H05B6/70 ,  H05B6/68

Abstract: Methods and apparatus for curing a substrate or polymer using variable microwave frequency are provided herein. In some embodiments, a method of curing a substrate or polymer using variable microwave frequency includes: contacting a substrate or polymer with a plurality of predetermined discontinuous microwave energy bandwidths or a plurality of predetermined discontinuous microwave energy frequencies to cure the substrate or polymer.