Invention Application
- Patent Title: EPOXY ADHESIVE COMPOSITION
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Application No.: US17040761Application Date: 2019-03-11
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Publication No.: US20210002528A1Publication Date: 2021-01-07
- Inventor: Tasuku YAMADA , Shiori TATENO , Yousuke CHIBA , Takayuki MAEDA , Yukio OCHITANI , Hideaki TANAKA
- Applicant: SEKISUI CHEMICAL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee Address: JP Osaka
- Priority: JP2018-062503 20180328
- International Application: PCT/JP2019/009732 WO 20190311
- Main IPC: C09J163/00
- IPC: C09J163/00 ; C09J11/04

Abstract:
The present invention provides an epoxy adhesive composition capable of reducing re-aggregation of an adhesive layer modifier, maintaining favorable viscosity for a long period of time, exhibiting high adhesiveness, and reducing process failures during application of the adhesive. Provided is an epoxy adhesive composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; an adhesive layer modifier; and an epoxy resin, the epoxy adhesive composition having a ratio of an acid-modified group equivalent of the modified polyvinyl acetal resin to an epoxy equivalent of the epoxy resin (acid-modified group equivalent/epoxy equivalent) of 5.0 to 150.0, the epoxy adhesive composition having a number ratio of the acid-modified group to an epoxy group (acid-modified group number/epoxy group number) of 0.0005 to 0.5.
Public/Granted literature
- US11932785B2 Epoxy adhesive composition Public/Granted day:2024-03-19
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